Overview of vacuum hot pressing bonding machine uses
Main applications of the equipment:
1: Bonding of detection and analysis fluid chips used in the biological and pharmaceutical industries.
2: Bonding of modular medical monitoring chips
3: Bonding of human organ chips created based on microfluidics technology
4: Bonding of fluid chips with a small flow channel of 0.05mm
5: Bonding of various microfluidic mixing/droplet generation chips in the chemical industry
6: Bonding of various centrifugal chips and blood synthesis chips used in the pharmaceutical industry
7: Bonding of heterogeneous materials in the semiconductor industry.
Main parameters of vacuum hot pressing bonding machine
1: Maximum working temperature 350℃
2: Maximum working pressure 40KN (4T)
3: Maximum vacuum degree 200Pa (2mbar)
4: Work surface size: 500*500mm
5: Constant temperature stability of heating surface temperature (room temperature ~ 400℃): ±1 degrees Celsius
6: Machine weight: 450KG
7: Set pressure range: 0-40KN (4T)
8 : Pressure stability: (0-40KN range): ±20N
9: Pressure accuracy: (0-40KN range): ±4%
10: Vacuum accuracy: ±0.05pa
11: Heating table material: AL6061 surface hard anode
12: Heating control unit: Siemens PLC
13: Pressure control unit: Siemens PLC
14: Equipment display and operation interface: Siemens 12-inch LCD touch screen
15: Operating system: Siemens human-machine exchange interface
16: Operating parameter setting: 20-segment parameter intelligent continuous
17: One-key vacuum: Yes
18: Maximum heating rate: 6℃/minute
19: Fast heat dissipation method: Independent air cooling in the cavity
20: Pressure monitoring method: Real-time monitoring and real-time display
21: The screen displays the real-time temperature change curve: Yes
22: The screen displays the real-time pressure change curve: Yes
23: Pressure source: Siemens private service motor + reducer + Siemens driver
24: Vacuum pump standard: German Leybold vacuum pump
25: Vacuum gauge: German Leybold
26: Equipment rated voltage: 220V/50HZ
27: Equipment rated power: 4.2KW
28: Overall dimensions: 850 (length) * 680 (width) * 1800 (height) mm
29: Adjustable vacuum speed: Yes
30: Working parameters can be stored.
Advantages of vacuum hot pressing bonding
1: Suitable for bonding of various plastic materials (PMMA/PC/COC/PP/PEI, etc.)
2: No glue or other ingredients are required. Irreversible bonding force occurs when a certain pressure is applied at the glass transition temperature of the material surface.
3: The chip maintains the original physical and chemical properties of the material after bonding. It has good bonding advantages for some highly transparent plastic-based materials.
4: Good bonding force. Effectively avoids liquid seepage after gluing or laser bonding
5: Solved the problem that small-sized flow channels cannot be bonded
6: Chips with multi-layer substrates can be bonded at one time, which makes fluid chip design more convenient for integration
Operating environment
No special requirements
Minimum installation area 2 square meters, recommended 4 square meters
Ambient temperature: 10-40℃; relative humidity: 30-80%
