Our Core Value: One-Stop Microfluidic & Semiconductor Packaging Solutions
In-House Plasma Surface Activation System: Our self-developed, highly intelligent system significantly enhances bonding surface activity. It plays a critical role in improving bonding quality and guaranteeing chip packaging yields.
In-House Precision Machining Services: Equipped with medium and small-sized CNC engraving machines, we manufacture fluidic chips completely in-house. This perfectly satisfies low-volume trial demands, drastically shortens prototyping cycles, eliminates outsourcing delays, and accelerates your product development.
Full-Material Tooling & Sealing: We provide custom tooling and injection molding for a comprehensive range of plastic substrates, including PMMA, PC, PP, COC, COP, and PEI. We are fully proficient in multiple sealing technologies, including thermal pressing, adhesive bonding, laser welding, and ultrasonic welding.
Class 1000 Cleanroom: Purpose-built for fluidic chip packaging and inspection requiring ultra-high cleanliness. The facility can accommodate 10 bonding hot presses operating simultaneously, ensuring high production efficiency.
100,000+ Pcs Annual Capacity: Featuring a highly standardized and stable production line, our annual fluidic chip output is projected to exceed 100,000 pieces. Our robust manufacturing capabilities allow us to respond rapidly to large-volume orders.
Cross-Scale Manufacturing: Full-process manufacturing expertise spanning from large-scale fluidic chips to miniature microfluidic chips.
Industry-Specific Customization: Specializing in high-standard fluidic chip packaging dedicated to the pharmaceutical, food, and medical industries.
Advanced Packaging Support: Comprehensive process and technical support for semiconductor chip packaging and sealing.
Critical Equipment Supply: Directly addressing the pain points of advanced packaging processes like 2.5D/3D IC by providing core bonding equipment.
Ultra-Large Worktable: Expanded to 900 × 500 mm, specifically engineered for large-format chips.
Extreme Force Capabilities: Delivers a maximum pressure of up to 20 Tons with an exceptional pressure stability of ±0.05%.
Precision Temperature Control: Keeps temperature fluctuations tightly within ±1°C.
Superior Flatness: Achieves a post-bonding total flatness of 0.02 mm, preventing internal microchannels from deforming.
R&D, Manufacturing, and Sales: Vacuum thermal compression bonding systems (optimized for low, medium, and high-temperature bonding of plastics, silicon wafers, quartz, etc.).
Chip Machining & Sealing: Precision machining and versatile sealing services for multi-material microfluidic chips.
Tooling & Injection Molding: Custom mold design and volume injection molding for plastic-based chips.
OEM Mass Production: High-volume sealing and assembly services for plastic-based chips utilizing advanced thermal compression processes.
